EP2AGX190FF35I3G vs EP2AGZ225FF35I3G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX190FF35I3G disebabkan oleh Altera dan EP2AGZ225FF35I3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Altera
EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera
EP2AGX190FF35I3G ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP2AGX190FF35I3G | EP2AGZ225FF35I3G |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Arria II GX | — |
| Logic Elements (LE) | 181,165 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| User I/O Pins | 612 | — |
| Embedded Memory (bits) | 10,177,536 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | 8 high-speed transceiver channels (multi-gigabit) | 12 channels |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | 1,728 18x18 |
| PLLs | [DATA_NEEDED: PLL count] | 8 |
| Core Voltage | 0.9 V | 0.9 V |
| I/O Voltage Standards | 1.2 V to 3.3 V (LVTTL, LVCMOS, LVDS, HSTL, SSTL) | — |
| Process Node | 40 nm | — |
| Suhu Operasi | -40 °C to +100 °C (industrial, suffix I) | -40C to +100C (Industrial) |
| Speed Grade | 3 | I3 |
| Kemasan | 1152-ball FC-FBGA (FF35), 35 mm body | 1152-BGA (FBGA, FineLine BGA) |
| Ball Pitch | [DATA_NEEDED: 1.0 mm (typical for FF35)] | — |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | Surface Mount |
| Status RoHS | Compliant (suffix G) | Compliant |
| Lead-Free | Yes | — |
| Programming Toolchain | Quartus II / Quartus Prime | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Arria II GZ |
| Device Family | — | EP2AGZ |
| Logic Elements | — | 225,000 |
| User I/O | — | 554 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Embedded Memory | — | 17.4 Mbits |
| On-chip RAM | — | 1,152 Kbits |
| DLLs | — | 8 |
| Process Technology | — | 40 nm TSMC |
| Packaging | — | Tray |