EP2AGX45DF29I3NAD vs EP2AGX45DF29I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX45DF29I3NAD disebabkan oleh Intel dan EP2AGX45DF29I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2AGX45DF29I3N - Arria II GX FPGA 42K LE 364 I/O | Intel
EP2AGX45DF29I3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2AGX45DF29I3NAD | EP2AGX45DF29I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | — |
| Embedded RAM Bits | 3,517,440 | — |
| User I/Os | 364 | — |
| Kemasan | 780-ball FBGA (FineLine BGA) | 780-ball FC-FBGA (DF29) |
| Process Node | 40 nm | — |
| Transceivers | Multi-gigabit transceivers integrated | Up to 8 channels, 3.125 Gbps |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| Multipliers (18x18) | 156 (typical) | — |
| Speed Grade | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) | I3 |
| Temperature Grade | Industrial (I) | — |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Jenis Pemasangan | Surface Mount | Surface Mount (flip-chip BGA) |
| Core Voltage | [DATA_NEEDED: VCCINT typical value] | 0.9 V |
| Series | — | EP2AGX45 |
| Number of Logic Elements | — | 42,959 |
| Number of LABs/CLBs | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| Number of User I/O | — | 364 |
| Suhu Operasi | — | -40 C to +100 C (industrial) |
| Process Technology | — | 40 nm |
| Hard PCIe Controller | — | PCIe Gen1/Gen2 x1/x4 |
| Maximum User I/O Frequency | — | 500 MHz Fmax |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| External Memory Support | — | DDR2, DDR3, QDRII+, RLDRAM II |