EP2AGX45DF29I3NAD vs EP2AGX45DF29I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45DF29I3NAD sa pamamagitan ng Intel at EP2AGX45DF29I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX45DF29I3NAD | EP2AGX45DF29I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 42,959 | — |
| Logic Array Blocks (LABs) | 1,805 | — |
| Embedded RAM Bits | 3,517,440 | — |
| User I/Os | 364 | — |
| Packhaging | 780-ball FBGA (FineLine BGA) | 780-ball FC-FBGA (DF29) |
| Process Node | 40 nm | — |
| Transceivers | Multi-gigabit transceivers integrated | Up to 8 channels, 3.125 Gbps |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| Multipliers (18x18) | 156 (typical) | — |
| Speed Grade | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) | I3 |
| Temperature Grade | Industrial (I) | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (flip-chip BGA) |
| Core Voltage | [DATA_NEEDED: VCCINT typical value] | 0.9 V |
| Series | — | EP2AGX45 |
| Number of Logic Elements | — | 42,959 |
| Number of LABs/CLBs | — | 1,805 |
| Total RAM Bits | — | 3,517,440 |
| Number of User I/O | — | 364 |
| Temperature na Operasyon | — | -40 C to +100 C (industrial) |
| Process Technology | — | 40 nm |
| Hard PCIe Controller | — | PCIe Gen1/Gen2 x1/x4 |
| Maximum User I/O Frequency | — | 500 MHz Fmax |
| Embedded Multipliers | — | [DATA_NEEDED: 18x18 multiplier count] |
| External Memory Support | — | DDR2, DDR3, QDRII+, RLDRAM II |