EP2AGZ350FH29I3G vs EP2AGZ350FH29C3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ350FH29I3G disebabkan oleh Intel dan EP2AGZ350FH29C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2AGZ350FH29I3G EP2AGZ350FH29C3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Arria II GZ —
Logic Elements (LE) 350000 (approximately) —
Process Node 40 nm 40 nm TSMC
User I/O Count 281 —
Kemasan 780-FBGA (FineLine BGA, FH29) 780-ball FBGA (HBGA, 29x29 mm)
Temperature Grade Industrial (-40C to +100C) —
Jenis Pemasangan Surface Mount Surface Mount
Gambaran Suhu Operasi -40C to +100C —
Supply Voltage Core [DATA_NEEDED: VCC core voltage] —
Transceivers Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) 24 channels
Memory Interface DDR3 with read/write leveling support (family feature) —
Embedded Multipliers 18x18 hardware multipliers (family feature) —
Configuration Method Serial or parallel via Quartus II (family feature) —
Aras MSL 3 (per BGA package handling guidelines) [DATA_NEEDED: MSL rating]
Status RoHS Compliant Compliant
Lead Free Yes —
Boson Bebas [DATA_NEEDED: halogen free status] —
Logic Elements — 350,000
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
Embedded Memory (Bits) — 16,402,944
Embedded Memory Blocks — [DATA_NEEDED: M9K/M144K block count]
User I/O Pins — 281
Transceiver Data Rate (max) — 8.5 Gbps
PCI Express Hard IP — 4 x PCIe Gen2 (x1/x4)
External Memory Interface — DDR3 up to 800 MHz, DDR2, QDRII+
PLLs — 8 (4 enhanced, 4 fast)
Global Clocks — 16
Speed Grade — C3 (commercial, slowest)
Suhu Hubungan Operasi — 0C to +85C
Lead-Free — Yes

Laporan Datasheet & Sumber

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