EP2SGX30CF780I3 vs EP2SGX30CF780I4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30CF780I3 disebabkan oleh Intel dan EP2SGX30CF780I4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX30CF780I3 | EP2SGX30CF780I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | — |
| Maximum Internal Frequency | 622.08 MHz | 622.08 MHz |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | — |
| Kemasan | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch |
| Terminal Pitch | 1.0 mm | — |
| Suhu Operasi | -40 °C to +85 °C (Industrial) | -40C to +85C (Industrial) |
| Temperature Grade Suffix | I3 (Industrial) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | — |
| Status RoHS | [DATA_NEEDED: RoHS status not confirmed in supplied data] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 33,880 |
| Logic Cells / CLBs | — | 33,880 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Embedded Transceivers | — | 4 channels (up to 3.125 Gbps at C4) |
| Pin / Terminal Count | — | 780 |
| Lead-Free | — | Yes |
| Jenis Ingatan | — | Embedded SRAM, external DDR/DDR2/QDR support |
| Configuration | — | JTAG / passive serial / fast passive parallel |