EP2SGX30DF780C7 vs EP2SGX30DF780C5N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30DF780C7 disebabkan oleh Intel dan EP2SGX30DF780C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2SGX30DF780C5N EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel

EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel

EP2SGX30DF780C5N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2SGX30DF780C7 EP2SGX30DF780C5N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Family Stratix II GX —
Series Stratix II GX Stratix® II GX
Logic Elements (LE) 33,880 —
Embedded Memory (bits) 1,369,728 —
Memory Blocks 482 (M512/M4K/M-RAM) —
DSP Blocks 24 —
18x18 Multipliers 192 —
Maximum User I/O 361 —
Speed Grade -7 C5
Kemasan 780-Ball FBGA (DF780), 1.0 mm pitch —
Suhu Operasi 0C to +85C (Commercial) -40°C to +85°C (extended commercial)
Process Node 90 nm —
Core Voltage (VCCINT) 1.2 V (typ) —
Configuration PS / FPP / JTAG —
Transceiver Data Rate [DATA_NEEDED: SERDES data rate] —
Status RoHS [DATA_NEEDED: RoHS status] Compliant (lead-free finish)
Family Name — Stratix II GX
Logic Elements / Cells — 33,880
LABs / CLBs — 1,694
Total RAM Bits — 1,369,728
User I/O Count — 361
Package Type — FC-FBGA-780
Package Size — 29 mm x 29 mm
Ball Pitch — 1.0 mm
Core Voltage — 1.2 V
Internal Frequency (max) — 622 MHz
Process Technology — 90 nm CMOS
Jenis Pemasangan — Surface Mount
Aras MSL — [DATA_NEEDED: MSL level]
Design Tool — Quartus II

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