EP2SGX30DF780C7 vs EP2SGX30DF780C5N 比較

詳細並排比較 EP2SGX30DF780C7 由 Intel 與 EP2SGX30DF780C5N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2SGX30DF780C5N EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel

EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel

EP2SGX30DF780C5N ⚠ 最後購買機會

規格比較

參數 EP2SGX30DF780C7 EP2SGX30DF780C5N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 最後購買
Family Stratix II GX —
Series Stratix II GX Stratix® II GX
Logic Elements (LE) 33,880 —
Embedded Memory (bits) 1,369,728 —
Memory Blocks 482 (M512/M4K/M-RAM) —
DSP Blocks 24 —
18x18 Multipliers 192 —
Maximum User I/O 361 —
Speed Grade -7 C5
封裝 780-Ball FBGA (DF780), 1.0 mm pitch —
工作溫度 0C to +85C (Commercial) -40°C to +85°C (extended commercial)
Process Node 90 nm —
Core Voltage (VCCINT) 1.2 V (typ) —
Configuration PS / FPP / JTAG —
Transceiver Data Rate [DATA_NEEDED: SERDES data rate] —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant (lead-free finish)
Family Name — Stratix II GX
Logic Elements / Cells — 33,880
LABs / CLBs — 1,694
Total RAM Bits — 1,369,728
User I/O Count — 361
Package Type — FC-FBGA-780
Package Size — 29 mm x 29 mm
Ball Pitch — 1.0 mm
Core Voltage — 1.2 V
Internal Frequency (max) — 622 MHz
Process Technology — 90 nm CMOS
安裝類型 — Surface Mount
MSL 等級 — [DATA_NEEDED: MSL level]
Design Tool — Quartus II

資料表與資源

瀏覽所有產品 建立 BOM 索取報價