EP2SGX30DF780C7 vs EP2SGX30DF780C5N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30DF780C7 sa pamamagitan ng Intel at EP2SGX30DF780C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP2SGX30DF780C5N EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel

EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel

EP2SGX30DF780C5N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP2SGX30DF780C7 EP2SGX30DF780C5N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Huling Pagbili
Family Stratix II GX —
Series Stratix II GX Stratix® II GX
Logic Elements (LE) 33,880 —
Embedded Memory (bits) 1,369,728 —
Memory Blocks 482 (M512/M4K/M-RAM) —
DSP Blocks 24 —
18x18 Multipliers 192 —
Maximum User I/O 361 —
Speed Grade -7 C5
Packhaging 780-Ball FBGA (DF780), 1.0 mm pitch —
Temperature na Operasyon 0C to +85C (Commercial) -40°C to +85°C (extended commercial)
Process Node 90 nm —
Core Voltage (VCCINT) 1.2 V (typ) —
Configuration PS / FPP / JTAG —
Transceiver Data Rate [DATA_NEEDED: SERDES data rate] —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant (lead-free finish)
Family Name — Stratix II GX
Logic Elements / Cells — 33,880
LABs / CLBs — 1,694
Total RAM Bits — 1,369,728
User I/O Count — 361
Package Type — FC-FBGA-780
Package Size — 29 mm x 29 mm
Ball Pitch — 1.0 mm
Core Voltage — 1.2 V
Internal Frequency (max) — 622 MHz
Process Technology — 90 nm CMOS
Uri ng Pagpapasok — Surface Mount
Level ng MSL — [DATA_NEEDED: MSL level]
Design Tool — Quartus II

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