EP2SGX60DF780C4N vs EP2SGX60DF780C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60DF780C4N disebabkan oleh Intel dan EP2SGX60DF780C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2SGX60DF780C3N EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N ✗ Akhir Hayat

Pengandingan Spesifikasi

Parametr EP2SGX60DF780C4N EP2SGX60DF780C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Akhir Hidup
Family Stratix II GX Stratix II GX
Logic Elements 60,440 60,440
Logic Array Blocks (LABs) 3,022 —
Adaptive Logic Modules (ALMs) 24,176 —
User I/Os 364 364
Total RAM Bits 2,544,192 —
Embedded Multipliers (18x18) 144 —
DSP Blocks 36 —
Transceivers Up to 20 (up to 6.375 Gbps) —
PLLs 4 —
Global Clock Networks 16 —
Core Voltage 1.2 V 1.2 V
Process Node 90 nm CMOS —
Kemasan 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) —
Maximum Internal Frequency 717 MHz —
Suhu Operasi Commercial 0C to +85C [DATA_NEEDED: operating temperature range C]
Speed Grade C4 —
Status RoHS Lead-free (per part suffix N) Compliant (per distributor listing)
Device Type — FPGA
LABs/CLBs — 3,022
Total Memory Bits — 2,544,192
Package Type — 780-pin FC-FBGA (DF780)
Package Dimensions — 23 x 23 mm
Pitch — 1 mm
Process Technology — 90 nm
Internal Frequency — 717 MHz
Propagation Delay — [DATA_NEEDED: propagation delay ns]
Jenis Pemasangan — Surface Mount (BGA)

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