EP2SGX60DF780C4N vs EP2SGX60DF780C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C4N sa pamamagitan ng Intel at EP2SGX60DF780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP2SGX60DF780C3N EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N ✗ Tapus ng Buhay

Pagsanggunian na paghahambing

Parametro EP2SGX60DF780C4N EP2SGX60DF780C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Tapus ng Buhay
Family Stratix II GX Stratix II GX
Logic Elements 60,440 60,440
Logic Array Blocks (LABs) 3,022 —
Adaptive Logic Modules (ALMs) 24,176 —
User I/Os 364 364
Total RAM Bits 2,544,192 —
Embedded Multipliers (18x18) 144 —
DSP Blocks 36 —
Transceivers Up to 20 (up to 6.375 Gbps) —
PLLs 4 —
Global Clock Networks 16 —
Core Voltage 1.2 V 1.2 V
Process Node 90 nm CMOS —
Packhaging 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) —
Maximum Internal Frequency 717 MHz —
Temperature na Operasyon Commercial 0C to +85C [DATA_NEEDED: operating temperature range C]
Speed Grade C4 —
Tindminan RoHS Lead-free (per part suffix N) Compliant (per distributor listing)
Device Type — FPGA
LABs/CLBs — 3,022
Total Memory Bits — 2,544,192
Package Type — 780-pin FC-FBGA (DF780)
Package Dimensions — 23 x 23 mm
Pitch — 1 mm
Process Technology — 90 nm
Internal Frequency — 717 MHz
Propagation Delay — [DATA_NEEDED: propagation delay ns]
Uri ng Pagpapasok — Surface Mount (BGA)

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