EP2SGX90EF1152C3 vs EP2SGX90EF1152C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152C3 disebabkan oleh Intel dan EP2SGX90EF1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX90EF1152C3 | EP2SGX90EF1152C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements (LEs) | 90,960 | — |
| Total RAM Bits | 4,520,448 (4.5 Mbit) | — |
| User I/O Count | 558 | — |
| Number of LABs/CLBs | 4548 | 4548 |
| Kemasan | 1152-FBGA (FineLine BGA) | — |
| Number of Transceivers | 12 | [DATA_NEEDED: transceiver count per family] |
| Transceiver Data Rate | 3.125 - 6.375 Gbps | — |
| Number of PLLs | 4 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Speed Grade | C3 | EF |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Family | — | Stratix II GX |
| Logic Elements (LE) | — | 90960 |
| Total Memory Bits | — | 4520448 |
| User I/Os | — | 558 |
| Core Voltage | — | 1.2 V |
| Operating Frequency (max) | — | 816.9 MHz |
| Package Type | — | FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | — | 1152 balls |
| Package Dimensions | — | 34 mm x 34 mm |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |
| Temperature Grade | — | C3 (Commercial) |