EP2SGX90EF1152C3N vs EP2SGX90EF1152C5 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90EF1152C3N disebabkan oleh Intel dan EP2SGX90EF1152C5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2SGX90EF1152C3N EP2SGX90EF1152C5
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Obsolete
Series Stratix II GX Stratix II GX
Family Stratix II GX Stratix II GX
Logic Elements (LE) 90960 —
Number of LABs/CLBs 4548 [DATA_NEEDED: LAB count]
Total Memory Bits 4520448 —
User I/Os 558 —
Number of Transceivers [DATA_NEEDED: transceiver count per family] —
Process Technology 90 nm 90 nm
Core Voltage 1.2 V 1.15 V to 1.25 V
Operating Frequency (max) 816.9 MHz —
Suhu Operasi 0C to +85C (Commercial) Commercial grade (C5)
Package Type FC-FBGA (Flip-Chip Fine-pitch BGA) —
Package Pin Count 1152 balls —
Package Dimensions 34 mm x 34 mm —
Jenis Pemasangan Surface Mount Surface Mount
Lead-Free / RoHS Yes (RoHS compliant) —
Speed Grade EF —
Temperature Grade C3 (Commercial) —
Logic Elements — 90,960
Total RAM Bits — 4,520,448
Embedded Multipliers — 558 (18x18)
Number of I/O Banks — [DATA_NEEDED: I/O bank count]
Number of User I/O — [DATA_NEEDED: user I/O count]
Kemasan — 1152-BBGA, FCBGA
Package Size — 35 mm x 35 mm
Transceivers — Multi-gigabit embedded transceivers
Status RoHS — Compliant (per distributor listings)
Aras MSL — [DATA_NEEDED: MSL rating]
Supplier Device Package — 1152-FBGA (35x35)

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