EP2SGX90EF1152C3N vs EP2SGX90EF1152C5 比較

詳細並排比較 EP2SGX90EF1152C3N 由 Intel 與 EP2SGX90EF1152C5 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2SGX90EF1152C3N EP2SGX90EF1152C5
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 Obsolete
Series Stratix II GX Stratix II GX
Family Stratix II GX Stratix II GX
Logic Elements (LE) 90960 —
Number of LABs/CLBs 4548 [DATA_NEEDED: LAB count]
Total Memory Bits 4520448 —
User I/Os 558 —
Number of Transceivers [DATA_NEEDED: transceiver count per family] —
Process Technology 90 nm 90 nm
Core Voltage 1.2 V 1.15 V to 1.25 V
Operating Frequency (max) 816.9 MHz —
工作溫度 0C to +85C (Commercial) Commercial grade (C5)
Package Type FC-FBGA (Flip-Chip Fine-pitch BGA) —
Package Pin Count 1152 balls —
Package Dimensions 34 mm x 34 mm —
安裝類型 Surface Mount Surface Mount
Lead-Free / RoHS Yes (RoHS compliant) —
Speed Grade EF —
Temperature Grade C3 (Commercial) —
Logic Elements — 90,960
Total RAM Bits — 4,520,448
Embedded Multipliers — 558 (18x18)
Number of I/O Banks — [DATA_NEEDED: I/O bank count]
Number of User I/O — [DATA_NEEDED: user I/O count]
封裝 — 1152-BBGA, FCBGA
Package Size — 35 mm x 35 mm
Transceivers — Multi-gigabit embedded transceivers
RoHS 狀態 — Compliant (per distributor listings)
MSL 等級 — [DATA_NEEDED: MSL rating]
Supplier Device Package — 1152-FBGA (35x35)

資料表與資源

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