EP2SGX90FF1508C4ES vs EP2SGX90FF1508C3ES Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX90FF1508C4ES disebabkan oleh Intel dan EP2SGX90FF1508C3ES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2SGX90FF1508C4ES EP2SGX90FF1508C3ES
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Family Stratix II GX Stratix II GX
Logic Elements / Cells 90960 —
Logic Array Blocks (LABs) 4828 4,828
Configurable Logic Blocks (CLBs) 4828 —
Maximum Internal Frequency 717 MHz 816.9 MHz
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage (VCCINT) 1.2 V (1.15 V to 1.25 V) —
Transceivers 12 channels at up to 6.375 Gbps —
Embedded Memory 4828 Kbit TriMatrix memory blocks —
Embedded Multipliers 252 (18x18) —
User I/O Pins 650 (approx.) —
Package Type 1508-ball FC-FBGA —
Package Code MS-034AAR-1, FBGA-1508, 40 x 40 mm, 1 mm pitch —
Suhu Operasi 0 C to 85 C (Commercial / Extended) —
Grade Engineering Sample (ES) —
Status RoHS Compliant (verify by date code) [DATA_NEEDED: rohs]
Logic Elements — 90,960
Embedded Memory (TriMatrix) — 4,520,448 bits
Total RAM Bits — 4,520,448
Core Supply Voltage — 1.2 V
DSP Blocks — Yes (dedicated multiplier blocks)
Embedded Transceivers — Up to 3.125 Gbps multi-gigabit transceivers
Global Clock Networks — Up to 16
Regional Clock Networks — Up to 32 per device region
Kemasan — 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch
Jenis Pemasangan — Surface Mount
Configuration Interface — JTAG / EPCS serial flash / Passive parallel
Operating Temperature Grade — Commercial / Industrial (per part suffix)

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