EP2SGX90FF1508C4ES vs EP2SGX90FF1508C3ES Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX90FF1508C4ES sa pamamagitan ng Intel at EP2SGX90FF1508C3ES sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2SGX90FF1508C4ES EP2SGX90FF1508C3ES
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Family Stratix II GX Stratix II GX
Logic Elements / Cells 90960 —
Logic Array Blocks (LABs) 4828 4,828
Configurable Logic Blocks (CLBs) 4828 —
Maximum Internal Frequency 717 MHz 816.9 MHz
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage (VCCINT) 1.2 V (1.15 V to 1.25 V) —
Transceivers 12 channels at up to 6.375 Gbps —
Embedded Memory 4828 Kbit TriMatrix memory blocks —
Embedded Multipliers 252 (18x18) —
User I/O Pins 650 (approx.) —
Package Type 1508-ball FC-FBGA —
Package Code MS-034AAR-1, FBGA-1508, 40 x 40 mm, 1 mm pitch —
Temperature na Operasyon 0 C to 85 C (Commercial / Extended) —
Grade Engineering Sample (ES) —
Tindminan RoHS Compliant (verify by date code) [DATA_NEEDED: rohs]
Logic Elements — 90,960
Embedded Memory (TriMatrix) — 4,520,448 bits
Total RAM Bits — 4,520,448
Core Supply Voltage — 1.2 V
DSP Blocks — Yes (dedicated multiplier blocks)
Embedded Transceivers — Up to 3.125 Gbps multi-gigabit transceivers
Global Clock Networks — Up to 16
Regional Clock Networks — Up to 32 per device region
Packhaging — 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch
Uri ng Pagpapasok — Surface Mount
Configuration Interface — JTAG / EPCS serial flash / Passive parallel
Operating Temperature Grade — Commercial / Industrial (per part suffix)

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