EP3C25F256I7N vs EP3C25F324C8 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F256I7N disebabkan oleh Intel dan EP3C25F324C8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F256I7N | EP3C25F324C8 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Device Type | FPGA | — |
| Family | Cyclone III | — |
| Logic Elements | 24,624 | 24,624 LE |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Embedded Multipliers | 66 (18x18) | 66 (18 x 18) |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | — |
| Kemasan | 256-FBGA (FineLine BGA) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Suhu Operasi | -40C to +125C | 0 °C to +85 °C (commercial) |
| Speed Grade | 7 | 8 (commercial) |
| Process Technology | 65 nm low-power | 65 nm CMOS, SRAM-based |
| PLLs | 4 general-purpose PLLs | 4 |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (lead-free) | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | — |
| Series | — | Cyclone III |
| Logic Array Blocks | — | 1,539 LABs |
| User I/Os | — | 215 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Clock | — | 402 MHz |