EP3C25F256I7N vs EP3C25F324C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F256I7N sa pamamagitan ng Intel at EP3C25F324C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F256I7N | EP3C25F324C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Device Type | FPGA | — |
| Family | Cyclone III | — |
| Logic Elements | 24,624 | 24,624 LE |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Embedded Multipliers | 66 (18x18) | 66 (18 x 18) |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | — |
| Packhaging | 256-FBGA (FineLine BGA) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Temperature na Operasyon | -40C to +125C | 0 °C to +85 °C (commercial) |
| Speed Grade | 7 | 8 (commercial) |
| Process Technology | 65 nm low-power | 65 nm CMOS, SRAM-based |
| PLLs | 4 general-purpose PLLs | 4 |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (lead-free) | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | — |
| Series | — | Cyclone III |
| Logic Array Blocks | — | 1,539 LABs |
| User I/Os | — | 215 |
| Core Voltage | — | 1.2 V |
| Maximum Internal Clock | — | 402 MHz |