EP3C25F324C8 vs EP3C25F324C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C25F324C8 disebabkan oleh Intel dan EP3C25F324C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C25F324C8 | EP3C25F324C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Cyclone III | — |
| Logic Elements | 24,624 LE | — |
| Logic Array Blocks | 1,539 LABs | — |
| Embedded Memory | 608,256 bits | 608,256 bits |
| Embedded Multipliers | 66 (18 x 18) | — |
| User I/Os | 215 | — |
| PLLs | 4 | — |
| Process Technology | 65 nm CMOS, SRAM-based | 65 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | 8 (commercial) | — |
| Suhu Operasi | 0 °C to +85 °C (commercial) | — |
| Kemasan | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Maximum Internal Clock | 402 MHz | — |
| Status RoHS | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) | [DATA_NEEDED: RoHS status] |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Cyclone III |
| Logic Cells | — | 24,624 cells |
| Available I/O Pins | — | 215 I/O |
| Maximum Listed Frequency | — | 437.5 MHz |
| Terminal Count | — | 324 terminals |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Rectangular |
| Temperature Grading | — | Other |
| Programmability | — | Field programmable |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |