EP3C25F324C8 vs EP3C25F324C7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324C8 sa pamamagitan ng Intel at EP3C25F324C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3C25F324C7N EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel

EP3C25F324C7N ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro EP3C25F324C8 EP3C25F324C7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Series Cyclone III —
Logic Elements 24,624 LE —
Logic Array Blocks 1,539 LABs —
Embedded Memory 608,256 bits 608,256 bits
Embedded Multipliers 66 (18 x 18) —
User I/Os 215 —
PLLs 4 —
Process Technology 65 nm CMOS, SRAM-based 65 nm
Core Voltage 1.2 V 1.2 V
Speed Grade 8 (commercial) —
Temperature na Operasyon 0 °C to +85 °C (commercial) —
Packhaging 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch 324-ball FBGA
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Maximum Internal Clock 402 MHz —
Tindminan RoHS Non-compliant (per Lisleapex listing; original part number without 'N' suffix) [DATA_NEEDED: RoHS status]
Product Type — Field Programmable Gate Array (FPGA)
Device Family — Cyclone III
Logic Cells — 24,624 cells
Available I/O Pins — 215 I/O
Maximum Listed Frequency — 437.5 MHz
Terminal Count — 324 terminals
Terminal Form — Ball
Package Code — BGA
Package Shape — Rectangular
Temperature Grading — Other
Programmability — Field programmable
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

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