EP3C5F256C6 vs EP3C25F256C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256C6 disebabkan oleh Intel dan EP3C25F256C8N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5F256C6 | EP3C25F256C8N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | 66 |
| User I/Os | 182 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | 1.15 V to 1.25 V |
| Process Technology | 65 nm CMOS, low-k | — |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Kemasan | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-pin FBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | — |
| Status RoHS | Compliant (lead-free per FBGA package) | Compliant |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory Bits | — | 608,256 (594 Kbit) |
| User I/O Pins | — | 156 |
| Suhu Operasi | — | 0 C to +85 C (commercial) |
| Speed Grade | — | 8 |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes (Pb-free) |
| Boson Bebas | — | Yes |