EP3C5F256C6 vs EP3C25F256C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5F256C6 sa pamamagitan ng Intel at EP3C25F256C8N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5F256C6 | EP3C25F256C8N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | 66 |
| User I/Os | 182 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | 1.15 V to 1.25 V |
| Process Technology | 65 nm CMOS, low-k | — |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Packhaging | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-pin FBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | — |
| Tindminan RoHS | Compliant (lead-free per FBGA package) | Compliant |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Embedded Memory Bits | — | 608,256 (594 Kbit) |
| User I/O Pins | — | 156 |
| Temperature na Operasyon | — | 0 C to +85 C (commercial) |
| Speed Grade | — | 8 |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes (Pb-free) |
| Wala sa Halogen | — | Yes |