EP3C5F256C6N vs EP3C16F256I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256C6N disebabkan oleh Intel dan EP3C16F256I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5F256C6N | EP3C16F256I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Series | EP3C5 | — |
| Logic Elements (LEs) | 5136 | 15408 |
| Logic Array Blocks (LABs) | 182 (per DigiKey listing) | 963 |
| Total Memory Bits | 423936 | 516096 |
| Embedded 18x18 Multipliers | 23 | 56 |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | — |
| Core Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Suhu Operasi | 0 C to +85 C (commercial "C6" speed grade) | -40C to +100C (industrial, I7) |
| Kemasan | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Jenis Pemasangan | Surface Mount | — |
| RoHS / Lead-Free | Lead-free (per distributor listings) | — |
| Configuration Modes | Serial, Parallel, JTAG, AS, PS | — |
| Embedded Memory | — | 56 M9K blocks (504 Kbit) |
| Maximum User I/O Pins | — | 168 |
| Supply Voltage (Core) | — | 1.2 V typical |
| Process Technology | — | TSMC 60 nm low-leakage |
| Configuration | — | SRAM-based, requires external config device (EPCS/EPCQ) |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |