EP3C5F256C6N vs EP3C5F256C6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3C5F256C6N disebabkan oleh Intel dan EP3C5F256C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3C5F256C6N | EP3C5F256C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone III | Cyclone III |
| Series | EP3C5 | — |
| Logic Elements (LEs) | 5136 | — |
| Logic Array Blocks (LABs) | 182 (per DigiKey listing) | 5136 / 342 (per ADatasheet summary) |
| Total Memory Bits | 423936 | 423,936 bits |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | — |
| Core Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V (typical 1.2 V) |
| Suhu Operasi | 0 C to +85 C (commercial "C6" speed grade) | — |
| Kemasan | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| RoHS / Lead-Free | Lead-free (per distributor listings) | — |
| Configuration Modes | Serial, Parallel, JTAG, AS, PS | AS, PS, JTAG |
| Logic Elements (LE) | — | 5,136 |
| Embedded Memory | — | M9K blocks (per Cyclone III family) |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Process Technology | — | 65 nm CMOS, low-k |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |
| Status RoHS | — | Compliant (lead-free per FBGA package) |