EP3C5F256C6N vs EP3C5F256C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5F256C6N sa pamamagitan ng Intel at EP3C5F256C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C5F256C6N | EP3C5F256C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Series | EP3C5 | — |
| Logic Elements (LEs) | 5136 | — |
| Logic Array Blocks (LABs) | 182 (per DigiKey listing) | 5136 / 342 (per ADatasheet summary) |
| Total Memory Bits | 423936 | 423,936 bits |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | — |
| Core Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V (typical 1.2 V) |
| Temperature na Operasyon | 0 C to +85 C (commercial "C6" speed grade) | — |
| Packhaging | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| RoHS / Lead-Free | Lead-free (per distributor listings) | — |
| Configuration Modes | Serial, Parallel, JTAG, AS, PS | AS, PS, JTAG |
| Logic Elements (LE) | — | 5,136 |
| Embedded Memory | — | M9K blocks (per Cyclone III family) |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Process Technology | — | 65 nm CMOS, low-k |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |
| Tindminan RoHS | — | Compliant (lead-free per FBGA package) |