EP3SE110F780C3N vs EP3SE110F780C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780C3N disebabkan oleh Intel dan EP3SE110F780C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE110F780C3N | EP3SE110F780C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | — |
| User I/Os | 488 | — |
| Kemasan | 780-ball FCBGA (Flip-Chip BGA) | 780-BBGA, FCBGA (FineLine) |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | 8,936,448 bits (8.93 Mbit) |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Series | — | EP3SE110 |
| Logic Elements (LE) | — | 107,500 |
| Maximum User I/O | — | 488 |
| Embedded Multipliers | — | 768 (18x18) |
| PLLs | — | 4 |
| Process Node | — | 65 nm |
| Core Voltage (VCCINT) | — | 1.1 V |
| Suhu Operasi | — | 0C to +85C (Commercial) |
| Speed Grade | — | C2 |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |