EP3SE110F780C3N vs EP3SE110F780C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780C3N sa pamamagitan ng Intel at EP3SE110F780C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE110F780C3N | EP3SE110F780C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | — |
| Logic Array Blocks (LABs) | 4,300 | — |
| User I/Os | 488 | — |
| Packhaging | 780-ball FCBGA (Flip-Chip BGA) | 780-BBGA, FCBGA (FineLine) |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | — |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | 8,936,448 bits (8.93 Mbit) |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Series | — | EP3SE110 |
| Logic Elements (LE) | — | 107,500 |
| Maximum User I/O | — | 488 |
| Embedded Multipliers | — | 768 (18x18) |
| PLLs | — | 4 |
| Process Node | — | 65 nm |
| Core Voltage (VCCINT) | — | 1.1 V |
| Temperature na Operasyon | — | 0C to +85C (Commercial) |
| Speed Grade | — | C2 |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |