EP3SE110F780I3N vs EP3SE110F780I4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780I3N disebabkan oleh Intel dan EP3SE110F780I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N NrndPengandingan Spesifikasi
| Parametr | EP3SE110F780I3N | EP3SE110F780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| Logic Array Blocks (LABs) | 4,300 | — |
| Embedded Memory Bits | 8,936,448 (approximately 1.1 MB) | — |
| Maximum User I/Os | 488 | — |
| Core Voltage | 1.1 V (range 1.05 V to 1.15 V) | 0.9 V |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Kemasan | 780-pin FC-FBGA (Flip-Chip FineLine BGA) | 780-pin FC-FBGA (Flip-Chip BGA) |
| Suhu Operasi | -40 °C to +100 °C (Industrial, "I" grade) | — |
| Configuration Interface | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) | — |
| Boundary-Scan Test | Yes, per IEEE Std. 1149.1 | — |
| Speed Grade | 3 (Fast) | — |
| PLLs | Yes, with global and regional clock networks | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (FC-FBGA) |
| Status RoHS | Compliant | Compliant (per legacy Altera data) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Supply Voltage Tolerance | 1.05 V to 1.15 V | — |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Embedded Memory | — | 8,936,448 bits (8.9 Mbit) |
| Maximum Operating Frequency | — | 375 MHz |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |