EP3SE110F780I3N vs EP3SE110F780I4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780I3N sa pamamagitan ng Intel at EP3SE110F780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N NrndPagsanggunian na paghahambing
| Parametro | EP3SE110F780I3N | EP3SE110F780I4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| Logic Array Blocks (LABs) | 4,300 | — |
| Embedded Memory Bits | 8,936,448 (approximately 1.1 MB) | — |
| Maximum User I/Os | 488 | — |
| Core Voltage | 1.1 V (range 1.05 V to 1.15 V) | 0.9 V |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Packhaging | 780-pin FC-FBGA (Flip-Chip FineLine BGA) | 780-pin FC-FBGA (Flip-Chip BGA) |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial, "I" grade) | — |
| Configuration Interface | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) | — |
| Boundary-Scan Test | Yes, per IEEE Std. 1149.1 | — |
| Speed Grade | 3 (Fast) | — |
| PLLs | Yes, with global and regional clock networks | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (FC-FBGA) |
| Tindminan RoHS | Compliant | Compliant (per legacy Altera data) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Supply Voltage Tolerance | 1.05 V to 1.15 V | — |
| LABs (Logic Array Blocks) | — | 4,300 |
| User I/Os | — | 488 |
| Embedded Memory | — | 8,936,448 bits (8.9 Mbit) |
| Maximum Operating Frequency | — | 375 MHz |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Product Status | — | Not Recommended for New Designs (NRND) |