EP3SE260F1517I3 vs EP3SE260F1517C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517I3 disebabkan oleh Intel dan EP3SE260F1517C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel
EP3SE260F1517C3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1517I3 | EP3SE260F1517C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/Os | 976 | — |
| Kemasan | 1517-BBGA, FCBGA | 1517-BBGA (FCBGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Junction Temperature Range | -40C to +125C | — |
| Core Voltage | 1.0 V typical | — |
| Process Technology | 65 nm CMOS | 65 nm TSMC low-power CMOS |
| Maximum Core Frequency | 717 MHz | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Status RoHS | Compliant | Compliant |
| Configuration | SRAM-based, volatile (requires external configuration device) | — |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Speed Grade | — | C3 (commercial) |
| Suhu Hubungan Operasi | — | 0 C to +85 C (commercial) |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |