EP3SE260F1517I3 vs EP3SE260F1517C3N 比較

詳細並排比較 EP3SE260F1517I3 由 Intel 與 EP3SE260F1517C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260F1517C3N EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N ⚠ 最後購買機會

規格比較

參數 EP3SE260F1517I3 EP3SE260F1517C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 最後購買
Family Stratix III E Stratix III E
Logic Elements 255,000 254,400
Embedded Memory (bits) 16,672,768 —
Logic Array Blocks (LABs) 10,200 —
Maximum User I/Os 976 —
封裝 1517-BBGA, FCBGA 1517-BBGA (FCBGA)
安裝類型 Surface Mount Surface Mount
Operating Temperature Grade Industrial —
Junction Temperature Range -40C to +125C —
Core Voltage 1.0 V typical —
Process Technology 65 nm CMOS 65 nm TSMC low-power CMOS
Maximum Core Frequency 717 MHz —
I/O Standards Supported LVDS, LVTTL, LVCMOS, HSTL, SSTL —
RoHS 狀態 Compliant Compliant
Configuration SRAM-based, volatile (requires external configuration device) —
Embedded Memory — 16,672,768 bits (16.7 Mbits)
User I/Os — 976
DSP Blocks (18x18 Multipliers) — 816
M9K Memory Blocks — 1,040
Maximum Transceiver Data Rate — 600 Mbps
PLLs — 4
Global Clock Networks — 16
Speed Grade — C3 (commercial)
工作接面溫度 — 0 C to +85 C (commercial)
External Memory Interfaces — DDR3, DDR2, QDRII+, RLDRAM2

資料表與資源

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