EP3SE260F1517I4L vs EP3SE260F1517I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517I4L disebabkan oleh Intel dan EP3SE260F1517I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260F1517I4L | EP3SE260F1517I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Family | Stratix III Enhanced (E) | Stratix® III E |
| Series | Stratix III | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.6 Mbits) | — |
| Maximum User I/O | 976 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Dimensions | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40C to +100C (Industrial) | — |
| Temperature Grade | Industrial | Industrial (I): -40 °C to +100 °C |
| Speed Grade | I4 | -3 (fastest) |
| Lead-Free / RoHS | Yes (L suffix) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Process Technology | 65 nm CMOS | 65 nm |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel | JTAG / Passive Serial / Active Serial |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 976 |
| Core Voltage | — | 1.1 V |
| Kemasan | — | 1517-ball FC-FBGA |
| Suhu Hubungan Operasi | — | -40 °C to +100 °C |
| Lead-Free | — | Yes |
| Internal Logic Performance | — | Up to 500 MHz |
| Memory Subsystems | — | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers |
| DSP Blocks | — | Yes (dedicated multiply-accumulate) |