EP3SE260F1517I4L vs EP3SE260F1517I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I4L sa pamamagitan ng Intel at EP3SE260F1517I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517I4L | EP3SE260F1517I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Family | Stratix III Enhanced (E) | Stratix® III E |
| Series | Stratix III | — |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits (16.6 Mbits) | — |
| Maximum User I/O | 976 | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Dimensions | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Temperature Grade | Industrial | Industrial (I): -40 °C to +100 °C |
| Speed Grade | I4 | -3 (fastest) |
| Lead-Free / RoHS | Yes (L suffix) | — |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | — |
| Process Technology | 65 nm CMOS | 65 nm |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel | JTAG / Passive Serial / Active Serial |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 976 |
| Core Voltage | — | 1.1 V |
| Packhaging | — | 1517-ball FC-FBGA |
| Temperature ng Junction na Operasyon | — | -40 °C to +100 °C |
| Lead-Free | — | Yes |
| Internal Logic Performance | — | Up to 500 MHz |
| Memory Subsystems | — | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers |
| DSP Blocks | — | Yes (dedicated multiply-accumulate) |