EP3SE260H780C4LN vs EP3SE260H780C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C4LN disebabkan oleh Intel dan EP3SE260H780C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780C4LN - Stratix III E FPGA 255K LE 780-FCBGA | Intel
EP3SE260H780C4LN ⚠ Bahagian terakhir untuk beliIntel
EP3SE260H780C3N - Stratix III E FPGA, 255K LE, 780-BGA | Intel / Altera
EP3SE260H780C3N ✓ AktifPengandingan Spesifikasi
| Parametr | EP3SE260H780C4LN | EP3SE260H780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Stratix III E | — |
| Logic Elements | 255,000 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Multipliers (18x18) | 384 | — |
| User I/O Count | 488 | — |
| Kemasan | 780-ball FCBGA (FineLine BGA) | 780-BBGA, FCBGA (H780) |
| Speed Grade | C4 (commercial, moderate speed) | — |
| Suhu Operasi | 0C to +85C (commercial) | 0 °C to +85 °C (C grade, commercial) |
| Core Voltage (VCC) | 1.0 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Auxiliary Voltage (VCCPD/VCCPT) | 2.5 V / 3.0 V | — |
| PLLs | 8 | — |
| Global Clock Networks | 16 | — |
| Process Node | 40 nm TSMC | — |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| Status RoHS | Compliant | Compliant (lead-free 'N' suffix) |
| Aras MSL | 3 (168 hours) | — |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Number of LABs/CLBs | — | 10,200 |
| User I/Os | — | 488 |
| Number of Pins / Balls | — | 780 |
| Jenis Pemasangan | — | Surface Mount |
| Process Technology | — | 40 nm CMOS |
| Maximum Core Frequency | — | [DATA_NEEDED: maximum core frequency MHz] |
| Supply Voltage (VCCINT) | — | [DATA_NEEDED: VCCINT nominal V] |
| Transceivers | — | [DATA_NEEDED: number of embedded transceivers and max data rate] |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks and precision] |
| Tingkat sensitiviti Air Nama (MSL) | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Configuration Method | — | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel |
| Design Toolchain | — | Altera Quartus II (legacy); Intel Quartus Prime |