EP3SE260H780C4N vs EP3SE260H780I4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780C4N disebabkan oleh Intel dan EP3SE260H780I4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260H780I4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
EP3SE260H780I4N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260H780C4N | EP3SE260H780I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Total RAM Bits | 16,672,768 | — |
| Embedded Memory | M9K and M144K blocks | — |
| User I/O Pins | 488 | — |
| DSP Blocks (18x18 Multipliers) | 768 | — |
| PLLs | 12 | — |
| Process Node | 65 nm CMOS | — |
| Core Voltage | 0.86 V to 1.15 V | 1.1 V |
| Maximum Core Clock Frequency | 450 MHz | — |
| Kemasan | 780-ball FCBGA (Flip Chip BGA) | 780-pin FC-HFBGA (FCBGA) |
| Jenis Pemasangan | Surface Mount | — |
| Tingkat sensitiviti Air Nama (MSL) | 3 (168 hours) | — |
| Suhu Operasi | 0C to +85C (commercial) | -40C to +100C (Industrial) |
| Configuration Method | Serial/Parallel via Quartus II | — |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/Os | — | 488 |
| Process Technology | — | 65 nm |
| Maximum Operating Frequency | — | 450 MHz |
| Package Dimensions | — | 33 mm x 33 mm |
| Ball Pitch | — | [DATA_NEEDED: BGA ball pitch in mm] |
| Configuration Modes | — | AS, PS, JTAG, FPP |
| Boundary Scan | — | IEEE Std. 1149.1 (JTAG) |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |