EP3SE260H780I4L vs EP3SE260H780C4N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780I4L disebabkan oleh Intel dan EP3SE260H780C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE260H780I4L EP3SE260H780C4N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Family Stratix III E (Enhanced) Stratix III E (Enhanced)
Logic Elements 255,000 255,000
Total Memory Bits 16,672,640 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 —
Core Voltage 0.9 V 0.86 V to 1.15 V
Process Technology 65 nm —
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
Jenis Pemasangan Surface Mount (flip-chip) Surface Mount
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
Suhu Operasi Industrial, -40C to +85C 0C to +85C (commercial)
Status RoHS Compliant (lead-free) —
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel —
Pin/Package 780-BBGA, FCBGA (flip-chip) —
Logic Array Blocks (LABs) — 10,200
Total RAM Bits — 16,672,768
Embedded Memory — M9K and M144K blocks
User I/O Pins — 488
DSP Blocks (18x18 Multipliers) — 768
PLLs — 12
Process Node — 65 nm CMOS
Maximum Core Clock Frequency — 450 MHz
Kemasan — 780-ball FCBGA (Flip Chip BGA)
Tingkat sensitiviti Air Nama (MSL) — 3 (168 hours)
Configuration Method — Serial/Parallel via Quartus II

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