EP3SE260H780I4L vs EP3SE260H780C4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4L sa pamamagitan ng Intel at EP3SE260H780C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780I4L EP3SE260H780C4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix III E (Enhanced) Stratix III E (Enhanced)
Logic Elements 255,000 255,000
Total Memory Bits 16,672,640 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 —
Core Voltage 0.9 V 0.86 V to 1.15 V
Process Technology 65 nm —
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
Uri ng Pagpapasok Surface Mount (flip-chip) Surface Mount
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
Temperature na Operasyon Industrial, -40C to +85C 0C to +85C (commercial)
Tindminan RoHS Compliant (lead-free) —
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel —
Pin/Package 780-BBGA, FCBGA (flip-chip) —
Logic Array Blocks (LABs) — 10,200
Total RAM Bits — 16,672,768
Embedded Memory — M9K and M144K blocks
User I/O Pins — 488
DSP Blocks (18x18 Multipliers) — 768
PLLs — 12
Process Node — 65 nm CMOS
Maximum Core Clock Frequency — 450 MHz
Packhaging — 780-ball FCBGA (Flip Chip BGA)
Level ng Sensitivity sa Asid ng Moisture (MSL) — 3 (168 hours)
Configuration Method — Serial/Parallel via Quartus II

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