EP3SE50F484C4 vs EP3SE50F484C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484C4 disebabkan oleh Intel dan EP3SE50F484C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE50F484C4 EP3SE50F484C4 - Stratix III E FPGA 47.5K LE | Intel

EP3SE50F484C4 - Stratix III E FPGA 47.5K LE | Intel

EP3SE50F484C4 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE50F484C4 EP3SE50F484C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Obsolete
Family Stratix III E Stratix III E
Logic Elements 47,500 —
Embedded Memory 5,760 Kbits —
User I/Os 296 296
Logic Array Blocks (LABs) 1900 1,900
Kemasan FBGA-484 (FCBGA) 484-ball FBGA (FCBGA), 1.0 mm pitch
Suhu Operasi 0C to 85 C (commercial) 0C to +85 C (commercial, C suffix)
Internal Frequency [DATA_NEEDED: internal max frequency] —
Transceivers [DATA_NEEDED: transceiver count and rate] —
DSP Blocks [DATA_NEEDED: 18x18 multiplier count] —
Tegangan Pemberi Arus 0.9 V Core and I/O voltages per Stratix III E datasheet
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Status RoHS Compliant Lead-free (per DigiKey listing)
Lead-Free Yes —
Aras MSL [DATA_NEEDED: MSL level] 3 (per JEDEC J-STD-020 for FCBGA packages)
Device Logic Elements — 47,500
Adaptive Logic Modules (ALMs) — 18,750
Embedded Memory (Bits) — 5,760,000
Maximum Internal Frequency — 717 MHz (typical); 800 MHz per DigChip
Process Technology — TSMC 40 nm low-power CMOS
Configuration Mode — Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG
Design Software — Intel Quartus II (Stratix III support)
Status Lingkungan Hidup — Obsolete (per Worldway listing 2026-04-05)

Laporan Datasheet & Sumber

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