EP3SE50F484C4 vs EP3SE50F484C3N 比較

詳細並排比較 EP3SE50F484C4 由 Intel 與 EP3SE50F484C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE50F484C4 EP3SE50F484C4 - Stratix III E FPGA 47.5K LE | Intel

EP3SE50F484C4 - Stratix III E FPGA 47.5K LE | Intel

EP3SE50F484C4 ⚠ 最後購買機會

規格比較

參數 EP3SE50F484C4 EP3SE50F484C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 Obsolete
Family Stratix III E Stratix III E
Logic Elements 47,500 —
Embedded Memory 5,760 Kbits —
User I/Os 296 296
Logic Array Blocks (LABs) 1900 1,900
封裝 FBGA-484 (FCBGA) 484-ball FBGA (FCBGA), 1.0 mm pitch
工作溫度 0C to 85 C (commercial) 0C to +85 C (commercial, C suffix)
Internal Frequency [DATA_NEEDED: internal max frequency] —
Transceivers [DATA_NEEDED: transceiver count and rate] —
DSP Blocks [DATA_NEEDED: 18x18 multiplier count] —
供應電壓 0.9 V Core and I/O voltages per Stratix III E datasheet
安裝類型 Surface Mount Surface Mount (BGA)
RoHS 狀態 Compliant Lead-free (per DigiKey listing)
Lead-Free Yes —
MSL 等級 [DATA_NEEDED: MSL level] 3 (per JEDEC J-STD-020 for FCBGA packages)
Device Logic Elements — 47,500
Adaptive Logic Modules (ALMs) — 18,750
Embedded Memory (Bits) — 5,760,000
Maximum Internal Frequency — 717 MHz (typical); 800 MHz per DigChip
Process Technology — TSMC 40 nm low-power CMOS
Configuration Mode — Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG
Design Software — Intel Quartus II (Stratix III support)
生命週期狀態 — Obsolete (per Worldway listing 2026-04-05)

資料表與資源

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