EP3SE50F484I3N vs EP3SE50F484C4LN Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE50F484I3N disebabkan oleh Intel dan EP3SE50F484C4LN disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SE50F484I3N EP3SE50F484C4LN
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Stratix III E Stratix III E
Logic Elements 47,500 —
Number of LABs 1,900 —
Total Memory Bits 5,760,000 —
Maximum User I/O 296 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Core Voltage VCC 0.9 V —
Auxiliary Voltage VCCAUX 1.1 V —
Process Technology 65 nm —
Maximum Internal Frequency 500 MHz —
Speed Grade I3 (industrial, bin 3) C4
Suhu Operasi -40C to +100C (industrial) 0C to +85C (commercial)
Kemasan 484-pin FC-FBGA (flip-chip BGA) —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Lead-Free / RoHS Yes (N suffix) —
Configuration Method Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Embedded Multipliers (18x18) [DATA_NEEDED: number of 18x18 multipliers] —
Transceiver Count [DATA_NEEDED: number of embedded transceivers] —
Logic Elements (LE) — 47,500
LABs/CLBs — 1900
Total RAM Bits — 2,344,448 (2286 Kbit)
Number of I/O — 296
Number of Multipliers (18x18) — 384
Voltage - Supply (Core) — 0.85 V to 1.1 V
Voltage - Supply (I/O) — 1.5 V / 1.8 V / 2.5 V / 3.3 V
Kemasan / Case — 484-BBGA, FCBGA (FineLine BGA)
Lead Free / RoHS — Lead free / RoHS compliant
Process Node — 40 nm CMOS
Configuration — FPP / AS / JTAG

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