EP3SE80F1152C3N vs EP3SE110F1152C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE80F1152C3N disebabkan oleh Intel dan EP3SE110F1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE80F1152C3N EP3SE110F1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Series Stratix III E Stratix III
Logic Elements (LEs) 80,000 —
Total Memory Bits 6,843,392 bits —
Number of LABs/CLBs 3200 —
Number of User I/O 744 —
Bilangan Output 744 —
Kemasan / Case 1152-BBGA, FCBGA (FineLine BGA) —
Suhu Operasi 0C to +85C (commercial, C3 grade) 0 °C to 85 °C (commercial)
Speed/Power Grade C3 —
Process Technology 40 nm CMOS 65 nm TSMC
Jenis Pemasangan Surface Mount Surface Mount
Lead Free Yes —
Aras MSL 3 (per JEDEC J-STD-020) —
Configuration Memory SRAM-based, volatile (needs external config device) —
Status RoHS Compliant —
Family — Stratix III E
Logic Elements (LE) — 107,500
Logic Array Blocks (LABs) — 4,300
Total RAM Bits — 8,936,448
User I/Os — 744
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Speed Grade — C3
Gaya Pemasangan — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
Jenis Ingatan — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]
Lead-Free — Yes (per Altera/Intel datasheet family convention)

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