EP3SE80F1152C3N vs EP3SE110F1152C3N 比較

詳細並排比較 EP3SE80F1152C3N 由 Intel 與 EP3SE110F1152C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ 最後購買機會

規格比較

參數 EP3SE80F1152C3N EP3SE110F1152C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 最後購買
Series Stratix III E Stratix III
Logic Elements (LEs) 80,000 —
Total Memory Bits 6,843,392 bits —
Number of LABs/CLBs 3200 —
Number of User I/O 744 —
輸出數量 744 —
封裝 / 外殼 1152-BBGA, FCBGA (FineLine BGA) —
工作溫度 0C to +85C (commercial, C3 grade) 0 °C to 85 °C (commercial)
Speed/Power Grade C3 —
Process Technology 40 nm CMOS 65 nm TSMC
安裝類型 Surface Mount Surface Mount
Lead Free Yes —
MSL 等級 3 (per JEDEC J-STD-020) —
Configuration Memory SRAM-based, volatile (needs external config device) —
RoHS 狀態 Compliant —
Family — Stratix III E
Logic Elements (LE) — 107,500
Logic Array Blocks (LABs) — 4,300
Total RAM Bits — 8,936,448
User I/Os — 744
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Speed Grade — C3
安裝方式 — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
記憶體類型 — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]
Lead-Free — Yes (per Altera/Intel datasheet family convention)

資料表與資源

瀏覽所有產品 建立 BOM 索取報價