EP3SL200H780I3N vs EP3SL200H780I4L Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780I3N disebabkan oleh Intel dan EP3SL200H780I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP3SL200H780I3N EP3SL200H780I4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Stratix III L Stratix III L
Logic Elements 200,000 200,000
RAM Bits 10,901,504 —
User I/O 488 —
Kemasan 780-BBGA, FCBGA 780-pin FC-HFBGA (Flip-Chip)
Package Pin Count 780 —
Jenis Pemasangan Surface Mount Surface Mount
Suhu Operasi -40C to +100C (Industrial) -40C to +100C (Industrial)
Supply Voltage (Core) 0.9 V —
Technology CMOS, 40 nm —
Process Node 40 nm —
Number of Terminals 780 —
Case / Package Code BGA-780 —
Status RoHS Compliant Compliant
Lead-Free Yes —
Logic Array Blocks (LABs) — 8,000
Embedded Memory (Bits) — 10,901,504
Maximum User I/O — 488
Core Supply Voltage — 0.86 V to 1.15 V
Process Technology — 65 nm CMOS
Internal Performance — 375 MHz
Transceivers — Up to 24 channels
Transceiver Data Rate — Up to 6.375 Gbps
DSP Blocks — 9x9 / 18x18 / 36x36 multipliers
Memory Interface Support — DDR3, DDR2, DDR, QDR II+, RLDRAM II
JTAG Support — IEEE Std 1149.1 Boundary-Scan
Speed Grade — I4 (Industrial)
HardCopy Support — Compatible (Lattice-style migration path via HardCopy III)

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