EP3SL340F1760I3 vs EP3SL340F1760I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL340F1760I3 disebabkan oleh Intel dan EP3SL340F1760I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SL340F1760I3 | EP3SL340F1760I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Series | Stratix III L | — |
| Logic Elements | 337,500 LE | 337,500 |
| LABs (Logic Array Blocks) | 13,500 | — |
| Embedded Memory Bits | 18,822,144 bit | 18,821,144 bits |
| User I/Os | 1120 | — |
| Number of Pins / Balls | 1760 | — |
| Package Type | FC-FBGA (1760-ball, FineLine BGA) | — |
| Package Code | BGA1760, 42x42, 40 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm CMOS |
| Suhu Operasi | -40 °C to 100 °C (Industrial grade, I3 suffix) | -40C to +100C (Industrial) |
| Speed Grade | I3 (Industrial, mid-speed bin) | I3 |
| Jenis Pemasangan | Surface Mount | — |
| Status RoHS | Compliant (Pb-free BGA balls) | Compliant |
| Configuration Memory | SRAM-based, volatile (requires external configuration device) | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] | — |
| DSP Blocks | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Aras MSL | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) | — |
| Family | — | Stratix III L |
| Logic Array Blocks (LABs) | — | 13,500 |
| Maximum User I/O | — | 1120 |
| Kemasan | — | 1760-ball FC-FBGA (Flip-Chip BGA) |
| Ball Pitch | — | 1.0 mm |
| Configuration Method | — | JTAG / Serial / Parallel |
| Lead-Free | — | Yes |
| Design Software | — | Quartus II (legacy) |