EP3SL340F1760I3 vs EP3SL340F1760I3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL340F1760I3 sa pamamagitan ng Intel at EP3SL340F1760I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL340F1760I3 EP3SL340F1760I3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Series Stratix III L —
Logic Elements 337,500 LE 337,500
LABs (Logic Array Blocks) 13,500 —
Embedded Memory Bits 18,822,144 bit 18,821,144 bits
User I/Os 1120 —
Number of Pins / Balls 1760 —
Package Type FC-FBGA (1760-ball, FineLine BGA) —
Package Code BGA1760, 42x42, 40 —
Core Voltage 1.1 V 1.1 V
Process Technology 65 nm 65 nm CMOS
Temperature na Operasyon -40 °C to 100 °C (Industrial grade, I3 suffix) -40C to +100C (Industrial)
Speed Grade I3 (Industrial, mid-speed bin) I3
Uri ng Pagpapasok Surface Mount —
Tindminan RoHS Compliant (Pb-free BGA balls) Compliant
Configuration Memory SRAM-based, volatile (requires external configuration device) —
Transceivers [DATA_NEEDED: transceiver count and data rate for this F1760 variant] —
DSP Blocks [DATA_NEEDED: 18x18 multiplier count] —
PLLs [DATA_NEEDED: PLL count] —
Level ng MSL MSL3 (JEDEC J-STD-020, reflow 245 °C peak) —
Family — Stratix III L
Logic Array Blocks (LABs) — 13,500
Maximum User I/O — 1120
Packhaging — 1760-ball FC-FBGA (Flip-Chip BGA)
Ball Pitch — 1.0 mm
Configuration Method — JTAG / Serial / Parallel
Lead-Free — Yes
Design Software — Quartus II (legacy)

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