EP3SL50F780C2 vs EP4CE75F29C6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780C2 disebabkan oleh Intel dan EP4CE75F29C6 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL50F780C2 | EP4CE75F29C6 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Stratix III L | Cyclone IV E |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory (bits) | 2,184,192 | 2,810,880 |
| Maximum User I/Os | 488 | — |
| Core Voltage | 1.1 V | 1.2 V |
| Process Technology | 65 nm | 60 nm low power |
| Kemasan | 780-ball FCBGA (Flip-Chip BGA) | 780-ball FineLine BGA (F29, 29x29 mm) |
| Suhu Operasi | 0°C to +85°C (commercial) | 0C to +85C (Commercial) |
| Maximum Core Frequency | 600 MHz | — |
| Configuration Interface | JTAG / passive serial / fast passive parallel | — |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces | — |
| Embedded Memory Type | TriMatrix (MLAB, M9K, M144K blocks) | — |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Logic Elements | — | 75,408 |
| Total Registers | — | 7,950 |
| Embedded Multipliers (18x18) | — | 274 |
| Maximum User I/O Pins | — | 426 |
| PLLs | — | 4 |
| Global Clock Networks | — | 15 |
| Configuration Modes | — | AS / PS / JTAG / FPP |
| Memory Controller | — | DDR / DDR2 / QDRII SRAM |