EP3SL50F780C2 vs EP4CE75F29C6 比較
詳細並排比較 EP3SL50F780C2 由 Intel 與 EP4CE75F29C6 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SL50F780C2 | EP4CE75F29C6 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Stratix III L | Cyclone IV E |
| Logic Elements (LE) | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory (bits) | 2,184,192 | 2,810,880 |
| Maximum User I/Os | 488 | — |
| Core Voltage | 1.1 V | 1.2 V |
| Process Technology | 65 nm | 60 nm low power |
| 封裝 | 780-ball FCBGA (Flip-Chip BGA) | 780-ball FineLine BGA (F29, 29x29 mm) |
| 工作溫度 | 0°C to +85°C (commercial) | 0C to +85C (Commercial) |
| Maximum Core Frequency | 600 MHz | — |
| Configuration Interface | JTAG / passive serial / fast passive parallel | — |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces | — |
| Embedded Memory Type | TriMatrix (MLAB, M9K, M144K blocks) | — |
| RoHS 狀態 | Compliant | Compliant |
| 安裝類型 | Surface Mount (BGA) | — |
| Logic Elements | — | 75,408 |
| Total Registers | — | 7,950 |
| Embedded Multipliers (18x18) | — | 274 |
| Maximum User I/O Pins | — | 426 |
| PLLs | — | 4 |
| Global Clock Networks | — | 15 |
| Configuration Modes | — | AS / PS / JTAG / FPP |
| Memory Controller | — | DDR / DDR2 / QDRII SRAM |