EP3SL50F780C3G vs EP3SE50F780C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780C3G disebabkan oleh Intel dan EP3SE50F780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ Aktif
Pengandingan Spesifikasi
| Parametr | EP3SL50F780C3G | EP3SE50F780C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III L | Stratix III E |
| Logic Elements (LE) | 47,500 | 47,500 |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory (bits) | 2,184,192 | — |
| Distributed RAM | 2.08 Mbit | — |
| User I/O Count | 488 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (Commercial grade, 'C' suffix) |
| Temperature Grade Suffix | C (commercial, "3" speed grade) | — |
| Kemasan | 780-ball FBGA | 780-ball FC-FBGA (FineLine BGA) |
| Jenis Pemasangan | SMD/SMT | Surface Mount (BGA) |
| Packaging | Tray | — |
| Process Technology | TSMC 40 nm low-power | 65 nm |
| Configuration Method | SRAM-based, JTAG/AS configuration | — |
| Design Software | Intel Quartus II (v9.0+) | — |
| Status RoHS | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Embedded Memory (BRAM) | — | 5,760 Kbits |
| User I/Os | — | 488 |
| Logic Voltage | — | 0.9 V |
| Transceiver Speed (max) | — | 500 MHz |
| Total LABs/CLBs | — | 1900 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Aras MSL | — | [DATA_NEEDED: MSL level] |