EP3SL50F780C3G vs EP3SE50F780C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C3G sa pamamagitan ng Intel at EP3SE50F780C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP3SL50F780C3G | EP3SE50F780C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix III L | Stratix III E |
| Logic Elements (LE) | 47,500 | 47,500 |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory (bits) | 2,184,192 | — |
| Distributed RAM | 2.08 Mbit | — |
| User I/O Count | 488 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (Commercial grade, 'C' suffix) |
| Temperature Grade Suffix | C (commercial, "3" speed grade) | — |
| Packhaging | 780-ball FBGA | 780-ball FC-FBGA (FineLine BGA) |
| Uri ng Pagpapasok | SMD/SMT | Surface Mount (BGA) |
| Packaging | Tray | — |
| Process Technology | TSMC 40 nm low-power | 65 nm |
| Configuration Method | SRAM-based, JTAG/AS configuration | — |
| Design Software | Intel Quartus II (v9.0+) | — |
| Tindminan RoHS | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Embedded Memory (BRAM) | — | 5,760 Kbits |
| User I/Os | — | 488 |
| Logic Voltage | — | 0.9 V |
| Transceiver Speed (max) | — | 500 MHz |
| Total LABs/CLBs | — | 1900 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |