EP3SL70F484C2 vs EP3SL70F484C2N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F484C2 disebabkan oleh Intel dan EP3SL70F484C2N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL70F484C2 | EP3SL70F484C2N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III L FPGA | Stratix III L (logic-rich) |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory | 2,699,264 bits | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| User I/O Count | 296 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Maximum Core Frequency | 600 MHz | — |
| Package Type | 484-ball FC-FBGA (FineLine BGA) | — |
| Package Pin Count | 484 | — |
| Suhu Operasi | 0C to +85C (Commercial) | — |
| Speed Grade | C2 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Total Embedded Memory | — | 2,699,264 bits |
| User I/Os | — | 296 |
| Fabric Speed (max) | — | 600 MHz |
| Kemasan | — | 484-ball FC-FBGA |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (C2 grade) | — | 0C to +85C |
| Aras MSL | — | 3 |
| Lead-Free / Pb-Free Reflow | — | Yes |