EP3SL70F484C2 vs EP3SL70F484C2N 比較
詳細並排比較 EP3SL70F484C2 由 Intel 與 EP3SL70F484C2N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SL70F484C2 | EP3SL70F484C2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III L FPGA | Stratix III L (logic-rich) |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory | 2,699,264 bits | — |
| Logic Array Blocks (LABs) | 2,700 | 2,700 |
| User I/O Count | 296 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Maximum Core Frequency | 600 MHz | — |
| Package Type | 484-ball FC-FBGA (FineLine BGA) | — |
| Package Pin Count | 484 | — |
| 工作溫度 | 0C to +85C (Commercial) | — |
| Speed Grade | C2 | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| Total Embedded Memory | — | 2,699,264 bits |
| User I/Os | — | 296 |
| Fabric Speed (max) | — | 600 MHz |
| 封裝 | — | 484-ball FC-FBGA |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature (C2 grade) | — | 0C to +85C |
| MSL 等級 | — | 3 |
| Lead-Free / Pb-Free Reflow | — | Yes |